CMP, Generally known as thermal oxidation sprucing, makes use of MP at the side of substances to enhance the MRR and boost surface area good quality [20]. Figure 2 illustrates the schematic of a typical CMP process [21]. The SiC wafer, which can be mounted about the carrier, and the https://www.quora.com/profile/Trevor-Flatcher-2/Comparative-analysis-of-silicon-carbide-and-traditional-silicon-materials-Silicon-Carbide-vs-Traditional-Silicon-Mater